Toshiba Now Shipping Samples of 64-Layer, 512-gigabit 3D Flash Memory
Boosts line-up with largest capacity BiCS FLASH™ chip
Toshiba continues to refine BiCS FLASH™, and the next milestone on its development roadmap is the industry’s largest capacity*2, a 1-terabyte product with a 16-die stacked architecture in a single package. Plans call for the start of sample shipments in April 2017.
For the new 512-gigabit device, Toshiba deployed leading-edge 64-layer stacking process to realize a 65% larger capacity per unit chip size than the 48-layer 256-gigabit (32-gigabytes) device, and has increased memory capacity per silicon wafer, reducing the cost per bit.
Toshiba’s Memory business already mass produces 64-layer 256-gigabit (32-gigabytes) devices and will expand BiCS FLASH™ production. It will advance 3D technology to realize increased densities and finer processes in order to meet diversifying market needs.
*1: A structure stacking Flash memory cells vertically on a silicon substrate to realize significant density improvements over planar NAND Flash memory, where cells are formed on the silicon substrate.
*2: As of February 22, 2017. Toshiba survey.
* BiCS FLASH is a trademark of Toshiba Corporation.
About Toshiba
Founded in Tokyo in 1875, Toshiba Corporation is a Fortune Global 500 company that contributes to a better world and better lives with innovative technologies in Energy, Infrastructure and Storage. Guided by the philosophy of “Committed to People, Committed to the Future,” Toshiba promotes operations through a global network of 551 consolidated companies employing 188,000 people, with annual sales surpassing 5.6 trillion yen (US$50 billion; March 31, 2016).
Find out more about Toshiba at www.toshiba.co.jp/index.htm
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Website: http://www.toshiba.co.jp/index.htm
Contact
Toshiba Corporation
Storage & Electronic Devices Solutions Company
Public Relations & Investor Relations Group
Business Planning Division
Koichi Tanaka / Kota Yamaji
+81-3-3457-3576
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This news is a press release provided by Toshiba Corporation Storage & Electronic Devices Solutions Company.
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2017년 7월 3일 09:50
