STMicroelectronics First to Use Through-Silicon Vias for Smaller and Smarter MEMS Chips
“There is a great demand for smaller packages in the consumer market. ST’s breakthrough implementation of TSV in MEMS devices opens a path to reduced footprints and increased functionality in mobile phones and other gadgets,” said Benedetto Vigna, Corporate Vice President and General Manager of ST’s Analog, MEMS and Sensor Group. “High-performance 3D-chip integration in our smart sensors and multi-axis inertial modules marks another important milestone in our mission to make MEMS ubiquitous in all facets of life.”
STMicroelectronics has a long history and expertise in high-volume production of MEMS sensors and actuators. Five years ago, ST launched the Consumer MEMS revolution by making motion sensors small, accurate and affordable through the combination of innovative product design, deep application expertise, and bold and timely infrastructure investments. More than 1.6 billion ST’s MEMS chips has been sold to date, addressing applications in Consumer, Computer, Automotive, Industrial and Medical segments.
Website: http://www.st.com
Contact
JH LEE
Corporate Communications
Korea
STMicroelectronics
+82 2 3489 0145
This news is a press release provided by STMicroelectronics.
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2012년 1월 26일 13:19